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MICRF600 데이터시트(PDF) 17 Page - Micrel Semiconductor

부품명 MICRF600
상세설명  902-928MHz ISM Band Transceiver Module
PDF  19 Pages
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제조업체  MICREL [Micrel Semiconductor]
홈페이지  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MICRF600 데이터시트(HTML) 17 Page - Micrel Semiconductor

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Micrel, Inc.
MICRF600
September 2005
17
M9999-091905
Application Circuit Illustration
MICRF600
4004
LDO
MCU
Figure 10. Circuit illustration of MICRF600, LDO and MCU
Figure 10 shows a typical set-up with the MICRF600, a
Low-Drop-Out voltage regulator (LDO)
and a micro-
controller (MCU). When the MICRF600 and the MCU runs
on the same power supply (min 2.0, max. 2.5V), the IO
can be connected directly to the MCU. If the MCU needs a
higher VDD than the maximum specified VDD of the
MICRF600 (2.5V), voltage dividers need to be added on
the IO lines not to override the max. input voltage.
Figure 11 shows a recommended voltage divider circuit for
a MCU running at 3.0V and the MICRF600 at 2.5V.
3k3
18k
3k3
18k
3k3
18k
15k
MICRF6xx
MCU
CS
SCLK
IO
DATAIXO
DATACLK
LD
RSSI
CS
SCLK
IO
DATAIXO
DATACLK
LD
RSSI
Figure 11. How to connect MCU600 (2.5V) and MCU (3.0V)
Assembling the MICRF600
Recommended Reflow Temperature Profile
When the MICRF600 module is being automatically
assembled to a PCB, care must be taken not to expose
the module for temperature above the maximum specified.
Figure 12 shows the recommended reflow temperature
profile.
Figure 12. Recommended Reflow Temperature Reflow
Shock/Vibration during Reflow
The module has several components inside which are
assembled in a reflow process. These components may
reflow again when the module is assembled onto a PCB. It
is therefore, important that the module is not subjected to
any mechanical shock or vibration during this process.
Handassembling the MICRF600
It is recommended that solder paste also be used during
hand assembling of the module. Because of the module
ground pad on the bottom side, the module will be
assembled most efficiently if the heat is being subjected to
the bottom side of the PCB. The heat will be transferred
trough the PCB due the ground vias under the module
(see
Layout
Considerations).
In
addition,
it
is
recommended that a solder tip be used on the signal and
power pads. This will ensure that the solder points are
properly melted.



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