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MICRF600 데이터시트(PDF) 18 Page - Micrel Semiconductor |
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MICRF600 데이터시트(HTML) 18 Page - Micrel Semiconductor |
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18 / 19 page ![]() Micrel, Inc. MICRF600 September 2005 18 M9999-091905 Layout Recommended Land Pattern Figure 12 shows a recommended land pattern that facilitates both automatic and hand assembling. Figure 13. Recommended Land Pattern Layout Considerations Except for the antenna input/output signal, only digital and low frequency signals need to interface with the module. There is therefore no need of years of RF expertise to do a successful layout, as long as the following few points are being followed: • Proper ground is needed. If the PCB is 2-layer, the bottom layer should be kept only for ground. Avoid signal traces that split the ground plane. For a 4- layer PCB, it is recommended the second layer only for ground be kept. • A ground via should be placed close to all the ground pins. The bottom ground pad should be penetrated with 4-16 ground vias. • The antenna has a impedance of ~50Ω. The antenna trace should be kept to 50Ω to avoid signal reflection and loss of performance. Any transmission line calculator can be used to find the needed trace width given a board build up. Example: A trace width of 44 mil (1.12 mm) gives 50 impedance on a FR4 board (dielectric cons=4.4) with copper thickness of 35 µm and height (layer 1-layer 2 spacing) of 0.61 mm. |
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