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LM317S/NOPB 데이터시트(PDF) 6 Page - Texas Instruments |
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LM317S/NOPB 데이터시트(HTML) 6 Page - Texas Instruments |
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6 / 51 page ![]() 6 LM117, LM317-N SNVS774Q – MAY 2004 – REVISED JUNE 2020 www.ti.com Product Folder Links: LM117 LM317-N Submit Documentation Feedback Copyright © 2004–2020, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Power dissipation Internally Limited Input-output voltage differential −0.3 40 V Storage temperature, Tstg −65 150 °C (1) Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±3000 V may actually have higher performance. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM)(1) ±3000 V 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Operating temperature (LM117) −55 150 °C Operating temperature (LM317-N) 0 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report. (2) No heatsink. 7.4 Thermal Information, LM117 THERMAL METRIC(1) LM117 UNIT NDS (TO-3) NDT (TO) 2 PINS 3 PINS RθJA Junction-to-ambient thermal resistance(2) 39 186 °C/W RθJC(top) Junction-to-case (top) thermal resistance 2 21 °C/W |
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