LM317SSLASHNOPB datasheet(7/51 Pages) TI

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LM117, LM317-N

www.ti.com

SNVS774Q – MAY 2004 – REVISED JUNE 2020

Product Folder Links: LM117 LM317-N

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

(2)

When surface mount packages are used (SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing

the PCB copper area that is thermally connected to the package. See Heatsink Requirements for heatsink techniques.

(3)

No heatsink.

7.5 Thermal Information, LM317-N

THERMAL METRIC(1)(2)

LM317-N

UNIT

KTT

(TO-263)

NDE

(TO-220)

DCY

(SOT-223)

NDT

(TO)

NDP

(TO-252)

3 PINS

4 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

41.0

23.3

59.6

186(3)

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

43.6

16.2

39.3

51.3

°C/W

RθJB

Junction-to-board thermal resistance

23.6

4.9

8.4

—

28.6

°C/W

ψJT

Junction-to-top characterization parameter

10.4

2.7

1.8

—

3.9

°C/W

ψJB

Junction-to-board characterization parameter

22.6

4.9

8.3

—

28.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.9

1.1

—

0.9

°C/W

(1)

IMAX = 1.5 A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0 A for the DCY (SOT-223) package.

IMAX = 0.5 A for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA),

device maximum junction temperature (TJ), and package thermal resistance (RθJA). The maximum allowable power dissipation at any

temperature is : PD(MAX) = ((TJ(MAX) – TA) / RθJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).

(2)

Specifications and availability for military and space grades of LM117/883 can be found in the LM117QML data sheet. Specifications

and availability for military and space grades of LM117 can be found in the LM117JAN data sheet.

(3)

Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to

heating effects are covered under the specifications for thermal regulation.

7.6 LM117 Electrical Characteristics

Some specifications apply over full Operating Temperature Range as noted. Unless otherwise specified, TJ = 25°C, VIN −

VOUT = 5 V, and IOUT = 10 mA.

(1) (2)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Reference voltage

3 V

≤ (VIN − VOUT) ≤ 40 V,

10 mA

≤ IOUT ≤ IMAX

(1) (over full operating temperature range)

1.2

1.25

1.3

Line regulation

3 V

≤ (VIN − VOUT) ≤ 40 V

(3)

TJ = 25°C

0.01

0.02

%/V

over full operating

temperature range

0.02

0.05

Load regulation

10 mA

≤ IOUT ≤ IMAX

(1) (3)

TJ = 25°C

0.1%

0.3%

over full operating

temperature range

0.3%

Thermal regulation

20-ms pulse

0.03

0.07

%/W

Adjustment pin current

over full operating temperature range

100

μA

Adjustment pin current change

10 mA

≤ IOUT ≤ IMAX

(1)

3 V

≤ (VIN − VOUT) ≤ 40 V (over full operating temperature range)

0.2

μA

Temperature stability

TMIN ≤ TJ ≤ TMAX (over full operating temperature range)

Minimum load current

(VIN − VOUT) = 40 V (over full operating temperature range)

3.5

Current limit

(VIN − VOUT) ≤ 15 V

TO-3 Package (over full

operating temperature range)

1.5

2.2

3.4

TO-39 Package (over full

operating temperature range)

0.5

0.8

1.8

(VIN − VOUT) = 40 V

TO-3 package

0.3

0.4

TO-39 package

0.15

0.2

RMS output noise, % of VOUT

10 Hz

≤ f ≤ 10 kHz

0.003%

Ripple rejection ratio

VOUT = 10 V, f = 120 Hz, CADJ = 0 μF (over full operating

temperature range)

VOUT = 10 V, f = 120 Hz, CADJ = 10 μF (over full operating

temperature range)

Long-term stability

TJ = 125°C, 1000 hrs

0.3%

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