AFSC5G35E38

15

RF Device Data

NXP Semiconductors

PRODUCT DOCUMENTATION AND TOOLS

Refer to the following resources to aid your design process.

Application Notes

 AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family

 AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family

Development Tools

 Printed Circuit Boards

FAILURE ANALYSIS

At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis.

In cases where NXP is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third

party vendors with moderate success. For updates contact your local NXP Sales Office.

REVISION HISTORY

The following table summarizes revisions to this document.

Revision

Date

Description

0

July 2020

 Initial release of data sheet

1

Sept. 2020

 Update made to align data sheet to current standard