AD9517-2ASLASHPCBZ datasheet(17/80 Pages) AD

17 / 80 page

Data Sheet

AD9517-2

Rev. F | Page 17 of 80

ABSOLUTE MAXIMUM RATINGS

Table 18.

Parameter

Rating

VS, VS_LVPECL to GND

−0.3 V to +3.6 V

VCP to GND

−0.3 V to +5.8 V

REFIN, REFIN to GND

−0.3 V to VS + 0.3 V

REFIN to REFIN

−3.3 V to +3.3 V

RSET to GND

−0.3 V to VS + 0.3 V

CPRSET to GND

−0.3 V to VS + 0.3 V

CLK, CLK to GND

−0.3 V to VS + 0.3 V

CLK to CLK

−1.2 V to +1.2 V

SCLK, SDIO, SDO, CS to GND

−0.3 V to VS + 0.3 V

OUT0, OUT0, OUT1, OUT1, OUT2, OUT2,

OUT3, OUT3,OUT4, OUT4, OUT5, OUT5,

OUT6, OUT6, OUT7, OUT7 to GND

−0.3 V to VS + 0.3 V

SYNC to GND

−0.3 V to VS + 0.3 V

REFMON, STATUS, LD to GND

−0.3 V to VS + 0.3 V

Junction Temperature1

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (10 sec)

300°C

1 See Table 19 for θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Table 19.

Package Type1

θJA

Unit

48-Lead LFCSP

24.7

°C/W

1 Thermal impedance measurements were taken on a 4-layer board in still air

in accordance with EIA/JESD51-2.

ESD CAUTION

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