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SL3S1205FUD2/HAP 데이터시트(PDF) 5 Page - NXP Semiconductors |
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SL3S1205FUD2/HAP 데이터시트(HTML) 5 Page - NXP Semiconductors |
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5 / 38 page ![]() NXP Semiconductors SL3S1205_15 UCODE 8/8m 4 Ordering information Type number Package Name IC type Description Version SL3S1205FUD/HA Wafer UCODE 8 Die on sawn 8" 120 μm wafer 10 μm Polyimide spacer with Large Pads, Stealth Dicing not applicable SL3S1215FUD/HA Wafer UCODE 8m Die on sawn 8" 120 μm wafer 10 μm Polyimide spacer with Large Pads, Stealth Dicing not applicable SL3S1205FUD2/HA Wafer UCODE 8 Die on sawn 12" 120 μm wafer 10 μm Polyimide spacer with Large Pads, Conventional Dicing not applicable SL3S1215FUD2/HA Wafer UCODE 8m Die on sawn 12" 120 μm wafer 10 μm Polyimide spacer with Large Pads, Conventional Dicing not applicable SL3S1205FUD2/HAP Wafer UCODE 8 Die on sawn 12" 120 μm wafer 10 μm Polyimide spacer with Large Pads, Plasma Dicing not applicable SL3S1215FUD2/HAP Wafer UCODE 8m Die on sawn 12" 120 μm wafer 10 μm Polyimide spacer with Large Pads, Plasma Dicing not applicable Table 1. Ordering information SL3S1205_15 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 3.5 — 1 April 2021 COMPANY PUBLIC 398435 5 / 38 |
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