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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MPC8347ECVRADDB 데이터시트(PDF) 57 Page - NXP Semiconductors |
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MPC8347ECVRADDB 데이터시트(HTML) 57 Page - NXP Semiconductors |
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57 / 99 page  MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12 Freescale Semiconductor 57 Package and Pin Listings 18.3 Package Parameters for the MPC8347EA PBGA The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 620 plastic ball grid array (PBGA). Package outline 29 mm × 29 mm Interconnects 620 Pitch 1.00 mm Module height (maximum) 2.46 mm Module height (typical) 2.23 mm Module height (minimum) 2.00 mm Solder balls 62 Sn/36 Pb/2 Ag (ZQ package) 96.5 Sn/3.5Ag (VR package) Ball diameter (typical) 0.60 mm |
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