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STM32F732IE 데이터시트(PDF) 218 Page - STMicroelectronics |
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STM32F732IE 데이터시트(HTML) 218 Page - STMicroelectronics |
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218 / 226 page ![]() Package information STM32F732xx STM32F733xx 218/226 DS11854 Rev 6 7.7 WLCSP100 package information This WLCSP is a 100-ball, 4.341x4.775 mm, 0.4 mm pitch, wafer level chip scale package. Figure 96. WLCSP100 - Outline 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 E1 E2 E3 E4 E5 E6 E7 E8 E9 E10 F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 G1 G2 G3 G4 G5 G6 G7 G8 G9 G10 H1 H2 H3 H4 H5 H6 H7 H8 H9 H10 J1 J2 J3 J4 J5 J6 J7 J8 J9 J10 K1 K2 K3 K4 K5 K6 K7 K8 K9 K10 A084_WLCSP100_ME_V1 e1 F G A1 BALL LOCATION e2 E e e D BOTTOM VIEW A2 b FRONT VIEW aaa (4x) E D TOP VIEW A1 ORIENTATION REFERENCE SIDE VIEW A A2 A1 bbb Z DETAIL A DETAIL A ROTATED 90 SEATING PLANE BUMP eee Z A1 Z ccc ddd Z Z X Y b (100) |
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