STM32G0 datasheet(108/135 Pages) STMICROELECTRONICS

부품명	STM32G0

상세설명	Arm® Cortex®-M0 32-bit MCU, up to 128 KB Flash, 36 KB RAM, 4x USART, timers, ADC, DAC, comm. I/Fs, 1.7-3.6V

PDF	135 Pages

Scroll/Zoom	100%

제조업체	STMICROELECTRONICS [STMicroelectronics]

홈페이지	http://www.st.com

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108 / 135 page

Package information

STM32G071x8/xB

108/135

DS12232 Rev 4

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

6.1

WLCSP25 package information

WLCSP25 is a 25-ball, 2.30 x 2.48 mm wafer-level chip-scale package with 0.4 mm pitch.

Figure 32. WLCSP25 chip-scale package outline

1. Drawing is not to scale.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

4. Bump position designation per JESD 95-1, SPP-010.

A06J_WLCSP25_ME_V1

A1 ball location

aaa

(4X)

BOTTOM VIEW

TOP VIEW

bbb Z

DETAIL A

FRONT VIEW

SIDE VIEW

DETAIL A

ROTATED 90

BUMP

eee Z

b (25x)

ccc

ddd

STM32G0 데이터시트(PDF) 108 Page - STMicroelectronics