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STM32G0 데이터시트(PDF) 114 Page - STMicroelectronics |
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STM32G0 데이터시트(HTML) 114 Page - STMicroelectronics |
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114 / 135 page ![]() Package information STM32G071x8/xB 114/135 DS12232 Rev 4 Figure 39. Recommended footprint for UFQFPN32 package 1. Dimensions are expressed in millimeters Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 40. UFQFPN32 package marking example 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST's Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. A0B8_FP_V2 5.30 3.80 0.60 3.45 0.50 3.45 3.80 0.75 3.80 0.30 5.30 16 17 9 8 1 25 32 24 MSv47910V2 G071KB6 R Y WW Product identification (1) Date code Revision code Pin 1 identifier |
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