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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32G0 데이터시트(PDF) 125 Page - STMicroelectronics |
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STM32G0 데이터시트(HTML) 125 Page - STMicroelectronics |
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125 / 135 page  DS12232 Rev 4 125/135 STM32G071x8/xB Package information 129 Figure 51. Recommended footprint for UFBGA64 package ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 81. UFBGA64 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 Table 82. Recommended PCB design rules for UFBGA64 package Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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