STM32G0 datasheet(130/135 Pages) STMICROELECTRONICS

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DS12232 Rev 4

6.9

Thermal characteristics

The operating junction temperature TJ must never exceed the maximum given in

The maximum junction temperature in °C that the device can reach if respecting the

operating conditions, is:

TJ(max) = TA(max) + PD(max) x ΘJA

where:

•

TA(max) is the maximum operating ambient temperature in °C,

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

•

PD = PINT + PI/O,

–PINT is power dissipation contribution from product of IDD and VDD

–PI/O is power dissipation contribution from output ports where:

PI/O = Σ (VOL × IOL) + Σ ((VDDIO1 – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high

level in the application.

6.9.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (still air). Available from www.jedec.org.

6.9.2

Selecting the product temperature range

The temperature range is specified in the ordering information scheme shown in Section 7:

Ordering information.

Each temperature range suffix corresponds to a specific guaranteed ambient temperature at

maximum dissipation and to a specific maximum junction temperature.

As applications do not commonly use microcontrollers at their maximum power

consumption, it is useful to calculate the exact power consumption and junction temperature

to determine which temperature range best suits the application.

Table 21: General operating conditions.

Table 84. Package thermal characteristics

Symbol

Parameter

Package

Value

Unit

ΘJA

Thermal resistance

junction-ambient

LQFP64 10 × 10 mm

°C/W

UFBGA64 5 × 5 mm

LQFP48 7 × 7 mm

UFQFPN48 7 × 7 mm

LQFP32 7 × 7 mm

UFQFPN32 5 × 5 mm

UFQFPN28 4 × 4 mm

WLCSP25 2.3 × 2.5 mm

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