MIC5212 datasheet(4/18 Pages) MICROCHIP

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MIC5212

DS20005774B-page 4



2017 - 2022 Microchip Technology Inc. and its subsidiaries

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

–60

—

+150

°C

—

Lead Temperature

—

+260

—

°C

Soldering, 5 sec.

Junction Temperature

–40

—

+125

°C

—

Package Thermal Resistances

Thermal Resistance, SOIC-8Ld

JC

—

°C/W

Note 2

JA

—

°C/W

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

2: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical

specifications do not apply when operating the device outside of its operating ratings. The maximum

allowable power dissipation is a function of the maximum junction temperature, TJ(max), the junc-

tion-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power

dissipation at any ambient temperature is calculated using: PD(max) = (TJ(max) – TA) ÷ θJA. Exceeding the

maximum allowable power dissipation will result in excessive die temperature, and the regulator will go

into thermal shutdown. The θJA of the 8-lead SOIC (M) is 63°C/W mounted on a PC board.

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