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MF3DX3 데이터시트(PDF) 19 Page - NXP Semiconductors |
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MF3DX3 데이터시트(HTML) 19 Page - NXP Semiconductors |
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19 / 28 page ![]() NXP Semiconductors MF3D(H)x3 MIFARE DESFire EV3 contactless multi-application IC MF3D_H_x3_MIFARE_DESFire_EV3_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved. Product short data sheet Rev. 3.0 — 15 May 2020 COMPANY PUBLIC 612530 19 / 28 10 Package outline UNIT D REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUEDATE IEC JEDEC JEITA mm 35.05 34.95 For unspecified dimensions see PLLMC-drawing given in the subpackage code. DIMENSIONS(mm are the original dimensions) SOT500-2 03-09-17 06-05-22 - - - - - - - - - PLLMC: plastic leadless module carrier package; 35 mm wide tape SOT500-2 A(1) max. 0.33 0 10 20 mm scale A detail X X Note 1. Total package thickness, exclusive punching burr. D Figure 4. Package outline SOT500-2 (MOA4) |
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