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M76DW52003TA, M76DW52003BA

PART NUMBERING

Table 12. Ordering Information Scheme

Devices are shipped from the factory with the memory content bits erased to ’1’.

For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device,

please contact the STMicroelectronics Sales Office nearest to you.

Example:

Z T

Device Type

M76 = MMP (Flash + SRAM)

Architecture

D = Dual Operation

Operating Voltage

Flash Device Size (Die1 Density)

5 = 32 Mbit

SRAM Device Size (Die2 Density)

2 = 4 Mbit

Die3

0 = Die3 Density

Die4

0 = Die4 Density

Flash Specification Details

3T = 1/4 & 3/4 partitioning, Top boot block

3B = 1/4 & 3/4 partitioning, Bottom boot block

Stacked Specification Details

A = 0.15µm Flash & SRAM

Speed

70 = 70ns

90 = 90ns

Package and Temperature Range

Z = LFBGA73: 8 x 11.6mm, 0.8mm pitch

Option

T = Tape & Reel packing