AD8422ACPZ-R7 datasheet(26/27 Pages) AD

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AD8422

Data Sheet

Rev. B | Page 26 of 27

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

Figure 66. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

Figure 67. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

2.54

2.44

2.34

0.45

0.40

0.35

TOP VIEW

0.35

0.30

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.20 MIN

0.05 MAX

0.02 NOM

0.65 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET

SIDE VIEW

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 68. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-19)

Dimensions shown in millimeters

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