ADN8834ACPZ-R2 datasheet(6/27 Pages) AD

6 / 27 page

ADN8834

Data Sheet

Rev. B | Page 6 of 27

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

PVIN to PGNDL (WLCSP)

−0.3 V to +5.75 V

PVIN to PGNDS (WLCSP)

−0.3 V to +5.75 V

PVINL to PGNDL (LFCSP)

−0.3 V to +5.75 V

PVINS to PGNDS (LFCSP)

−0.3 V to +5.75 V

LDR to PGNDL (WLCSP)

−0.3 V to V

PVIN

LDR to PGNDL (LFCSP)

−0.3 V to V

PVINL

SW to PGNDS

−0.3 V to +5.75 V

SFB to AGND

−0.3 V to V

VDD

AGND to PGNDL

−0.3 V to +0.3 V

AGND to PGNDS

−0.3 V to +0.3 V

VLIM/SD to AGND

−0.3 V to V

VDD

ILIM to AGND

−0.3 V to V

VDD

VREF to AGND

−0.3 V to +3 V

VDD to AGND

−0.3 V to +5.75 V

IN1P to AGND

−0.3 V to V

VDD

IN1N to AGND

−0.3 V to V

VDD

OUT1 to AGND

−0.3 V to +5.75 V

IN2P to AGND

−0.3 V to V

VDD

IN2N to AGND

−0.3 V to V

VDD

OUT2 to AGND

−0.3 V to +5.75 V

EN/SY to AGND

−0.3 V to V

VDD

ITEC to AGND

−0.3 V to +5.75 V

VTEC to AGND

−0.3 V to +5.75 V

Maximum Current

VREF to AGND

20 mA

OUT1 to AGND

50 mA

OUT2 to AGND

50 mA

ITEC to AGND

50 mA

VTEC to AGND

50 mA

Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)

260°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages, and is

based on a 4-layer standard JEDEC board.

Table 4.

Package Type

Unit

25-Ball WLCSP

0.6

°C/W

24-Lead LFCSP

1.65

°C/W

ESD CAUTION

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