FS32K142HEX0MLFT datasheet(90/101 Pages) NXP

90 / 101 page

To determine the junction temperature of the device in the application when heat sinks

are not used, the Thermal Characterization Parameter (

ΨJT) can be used to determine the

junction temperature with a measurement of the temperature at the top center of the

package case using this equation:

where:

• TT = thermocouple temperature on top of the package (°C)

•

ΨJT = thermal characterization parameter (°C/W)

• PD = power dissipation in the package (W)

The thermal characterization parameter is measured per JESD51-2 specification using a

40 gauge type T thermocouple epoxied to the top center of the package case. The

thermocouple should be positioned so that the thermocouple junction rests on the

package. A small amount of epoxy is placed over the thermocouple junction and over

about 1 mm of wire extending from the junction. The thermocouple wire is placed flat

against the package case to avoid measurement errors caused by cooling effects of the

thermocouple wire.

Dimensions

8.1 Obtaining package dimensions

Package dimensions are provided in the package drawings.

To find a package drawing, go to http://www.nxp.com and perform a keyword search for

the drawing’s document number:

Package option

Document Number

Manufacture Code

32-pin QFN

SOT617-31

98ASA01350D

48-pin LQFP

SOT313-3

98ASH00962A

64-pin LQFP

SOT1699-1

98ASS23234W

100-pin LQFP

SOT407-3

98ASS23208W

100-pin MAPBGA

SOT1569-1

98ASA00802D

144-pin LQFP

SOT486-2

98ASS23177W

176-pin LQFP

SOT506-2

98ASS23479W

1. 5x5 mm package

Dimensions

S32K1xx Data Sheet, Rev. 14, 08/2021

NXP Semiconductors

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