ADPD6000 datasheet(9/89 Pages) AD

9 / 89 page

Data Sheet

ADPD6000

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 9 of 89

Table 5. Absolute Maximum Ratings

Parameter

Rating

AVDD to AGND

−0.3 V to +2.2 V

AVDD3 to AGND

−0.3 V to +3.9 V

DVDD to DGND

−0.3 V to +2.2 V

IOVDD to IOGND

−0.3 V to +3.9 V

GPIOx, MOSI, MISO, SCLK, CS to DGND

−0.3 V to +3.9 V

LEDxx to LGND

−0.3 V to +3.9 V

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure. θJC is the junction

to case thermal resistance.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

CB-36-101

42.15

0.98

°C/W

1 The thermal resistance values are defined as per the JESD51-12 standard.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD

sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

Machine model (MM) per ANSI/ESD STM5.2. MM voltage values

are for characterization only.

ESD Ratings for ADPD6000

Table 7. ADPD6000, 36-Ball WLCSP

ESD Model

Withstand Threshold (V)

Class

HBM

2000

CDM

750

C2B

100

Not applicable

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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