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2017 - 2022 Microchip Technology Inc.

DS20005798B-page 33

MIC45205

Notes:

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-3055-M3A Rev A

52-Lead Very Thick Plastic Quad Flat, No Lead (M3A) - 8x8x3 mm Body [B1QFN]

Micrel Legacy Package H3QFN88-52LD-PL-1

SOLDER MASK

OPENING

EXPOSED TRACE

KEEP OUT AREA

LEGEND

EXPOSED METAL

TRACE

7.60

7.60

0.80

0.80

0.63

2.38

2.80

0.62

0.50

Ø0.30

RECOMMENDED EXPOSED METAL TRACE

EXPOSED TRACE

KEEP OUT AREA

RECOMMENDED SOLDER STENCIL OPENINGS

3.15

3.15

3.12

3.12

7.40

7.40

4x 0.79

2.60

1.61

0.82

2.18

0.78

4X 1.20

47X 0.25

47X 0.60

1.13

0.12

47X 0.80

EXPOSED TRACE

KEEP OUT AREA

SOLDER STENCIL

OPENINGS

EXPOSED METAL TRACES