MIC45205 datasheet(5/40 Pages) MICROCHIP

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2017 - 2022 Microchip Technology Inc.

DS20005798B-page 5

MIC45205

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Junction Temperature

Range

–40

—

+125

°C

—

Absolute Maximum Junction

Temperature

TJ(ABSMAX)

—

+150

°C

—

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

TLEAD

—

+260

°C

Soldering, 10s

Package Thermal Resistances

Thermal Resistance B1QFN-52

JA

—

21.7

—

°C/W Note 2

Thermal Resistance B1QFN-52

JC

—

5.0

—

°C/W Note 2

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

2: θJA and θJC were measured using the MIC45205 evaluation board.

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