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L6711 데이터시트(PDF) 27 Page - STMicroelectronics

부품명 L6711
상세설명  3 PHASE CONTROLLER WITH DYNAMIC VID AND SELECTABLE DACs
PDF  38 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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L6711 데이터시트(HTML) 27 Page - STMicroelectronics

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L6711
mosfet of that phase until IINFOx re-cross the threshold or until the next clock cycle. This implies that the
device limits the peak of the inductor current.
In any case, the inductor current won't overcome the IOCPx value and this will represent the maximum peak
value to consider in the OC design.
The device works in Constant-Current, and the output voltage decreases as the load increase, until the
output voltage reaches the UVP threshold. When this threshold is crossed, all mosfets are turned off, the
FAULT pin is driven high and the device stops working. Cycle the power supply or the OUTEN pin to re-
start operation.
The transconductance resistor Rg can be designed considering that the device limits the inductor current
ripple peak. Moreover, when designing D-VID systems, the additional current due to the output filter
charge during dynamic VID transitions must be considered.
where
14 OSCILLATOR
The internal oscillator generates the triangular waveform for the PWM charging and discharging with a
constant current an internal capacitor. The switching frequency for each channel, FSW, is internally fixed
at 150kHz so that the resulting switching frequency at the load side results in being tripled.
The current delivered to the oscillator is typically 25
µA (corresponding to the free running frequency
Fsw=150kHz) and it may be varied using an external resistor (ROSC) connected between the OSC pin and
SGND or VCC (or a fixed voltage greater than 1.24V). Since the OSC pin is fixed at 1.24V, the frequency is
varied proportionally to the current sunk (forced) from (into) the pin considering the internal gain of 6KHz/
µA.
In particular connecting ROSC to SGND the frequency is increased (current is sunk from the pin), while
connecting ROSC to VCC=12V the frequency is reduced (current is forced into the pin), according to the
following relationships:
Maximum programmable switching frequency depends on the Current Reading Method selected. When
reading across LS mosfet, the maximum switching frequency per phase must be limited to 500kHz to
avoid current reading errors causing, as a consequence, current sharing errors. When reading across the
inductor, higher switching frequency can be approached (device power dissipation must be checked prior
to design high switching frequency systems).
Figure 20. ROSC vs. Switching Frequency
Rg
I
OCPx max
() RSENSE max
()
⋅
I
OCTH min
()
-----------------------------------------------------------------------
=
I
OCPx
I
OUT OCP
()
3
----------------------------
I
PP
∆
2
------------
I
D-VID
3
---------------
++
=
R
OSC vs. GND: FSW
150kHz
1.237
R
OSC kΩ
()
----------------------------- 6
kHz
µA
-----------
⋅
+
150kHz
7.422 10
6
⋅
R
OSC k Ω
()
-----------------------------
+
==
R
OSC vs. 12V: FSW
150 kHz
12-1.237
R
OSC kΩ
()
----------------------------- 6
kH z
µA
-----------
⋅
+
150kHz
6.457 10
7
⋅
R
OSC k Ω
()
-----------------------------
+
==
0
2000
4000
6000
8000
10000
12000
14000
25
50
75
100
125
150
0
200
400
600
800
1000
150
250
350
450
550
650
750
850
ROSC [k
Ω] to 12V vs. Selected FSW [kHz]
ROSC [k
Ω] to SGND vs. Selected FSW [kHz]



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