FXLS8967AF datasheet(89/98 Pages) NXP

89 / 98 page

NXP Semiconductors

FXLS8967AF

3-Axis Low-g Accelerometer

10X 0.25

0.15

10X 0.45

0.35

10X 0.400 Min1

2X 0.050 Typ2

2X 0.0375 Typ2

10X 0.425 Min

0.450 Typ

10X 0.825 Min1

0.850 Typ

10X 1.0

Package outline

8X 0.4

10X 0.200 Min

0.225 Typ

Package

Solder mask

PCB land pad

Package outline

PCB land pad

[1] PCB pad lengths exterior to the package edge should be at

least 0.4 mm long. If board space allows, a longer pad extension,

such as 0.6 mm will generally result in more consistent fillet

formation. This is because the inspectable solder fillet formation

will be influenced less by PCB assembly issues, such as misalignment.

[2] The solder mask clearance should be designed to be greater

than or equal to PCB vendor's solder mask registration.

Solder mask

opening

aaa-028908

Figure 29. PCB footprint guidelines

20 Glossary

Term

Description

Cross-axis sensitivity

Cross-axis sensitivity is the ratio of the measured acceleration for an axis to the input

acceleration along each axis orthogonal to the measured axis. Cross-axis sensitivity leads to

undesirable nonorthogonality of X, Y, and Z axes in the frame of reference of the assembled

device when mapping to other frames of reference. Cross-axis sensitivity is expressed as a

percentage of the orthogonal input acceleration with six separate cross-axis sensitivity terms

known as Sxy, Sxz, Syx, Syz, Szx, and Szy. The cross-axis sensitivity specification represents

the maximum of these six terms.

Table 121. Glossary

FXLS8967AF

All information provided in this document is subject to legal disclaimers.

Preliminary data sheet

Rev. 1.3 — 22 October 2021

89 / 98

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