AC244036 datasheet(61/78 Pages) MICROCHIP

61 / 78 page

 2006-2012 Microchip Technology Inc.

DS51292T-page 61

Appendix A. Debug Header Target Footprints

INTRODUCTION

To connect a debug header directly to a target board (without the use of a transition

socket) the following information will be helpful.

• DIP Device Footprints

• TQFP/PLCC Device Footprints

DIP DEVICE FOOTPRINTS

DIP device adapter footprints shown will accept adapter plugs like Samtec series APA

plugs. These plugs can be soldered in place during development/emulation and

eliminate the need for any other sockets.

FIGURE 16:

DIP FOOTPRINT

TQFP/PLCC DEVICE FOOTPRINTS

TQFP/PLCC device adapter footprints shown will accept board stackers like Samtec

series DWM 0.050 Pitch Stackers. These stackers can be soldered in place during

development/emulation and eliminate the need for any other sockets.

FIGURE 17:

SINGLE-ROW TQFP/PLCC FOOTPRINT

0.100

UNLESS OTHERWISE SPECIFIED,

DIMENSIONS ARE IN INCHES.

Drawing of DIP is 40-pin.

DIP

8-Pin

0.300

14-Pin

0.300

18-Pin

0.300

20-Pin

0.300

28-Pin

0.300

40-Pin

0.600

0.028 DIA

PLATED-THRU

HOLES

0.050

0.800

UNLESS OTHERWISE SPECIFIED,

DIMENSIONS ARE IN INCHES.

Drawing of device is 44-pin TQFP/PLCC.

0.028 DIA

PLATED-THRU

HOLES

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