MPXV6115VC6U

Sensors

Freescale Semiconductor

3

Figure 2. Cross Sectional Diagram SOP

(Not to Scale)

Figure 2 illustrates the absolute sensing chip in the basic

Small Outline chip carrier (Case 482).

Figure 3. Typical Application Circuit

(Output Source Current Operation)

Figure 3 shows a typical application circuit (output source

current operation).

Figure 4. Output versus Absolute Pressure

Figure 4 shows the sensor output signal relative to

pressure input. Typical minimum and maximum output

curves are shown for operation over 0 to 85

°C temperature

range. The output will saturate outside of the rated pressure

range.

A fluorosilicone gel isolates the die surface and wire bonds

from the environment, while allowing the pressure signal to

be transmitted to the silicon diaphragm. The

MPXV6115VC6U pressure sensor operating characteristics,

internal reliability and qualification tests are based on use of

dry air as the pressure media. Media other than dry air may

have adverse effects on sensor performance and long-term

reliability. Contact the factory for information regarding media

compatibility in your application.

Fluorosilicone

Gel Die Coat

Wire

Bond

Differential Sensing

Element

Thermoplastic

Case

Stainless

Steel Cap

Lead

Frame

P1

P2

Die Bond

Die

+5.0 V

GND Pin 3

MPXV6115VC6U

to ADC

100 nF

51 K

47 pF

Max

Transfer Function:

Min

Transfer Function MPXV6115VC6U

5

4.5

4

3.5

3

2.5

2

1.5

1

0.5

0

TEMP = 0-85

° C

-115

-95

-75

-55

-35

-15

0