NAND01GR3B datasheet(57/59 Pages) STMICROELECTRONICS

57 / 59 page

57/59

NAND512-B, NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B

PART NUMBERING

Table 31. Ordering Information Scheme

Devices are shipped from the factory with the memory content bits, in valid blocks, erased to ’1’. For further

information on any aspect of this device, please contact your nearest ST Sales Office.

Example:

NAND02GR3B

A ZA

Device Type

NAND Flash Memory

Density

512 = 512Mb

01G = 1Gb

02G = 2Gb

04G = 4Gb

08G = 8Gb

Operating Voltage

R = VDD = 1.7 to 1.95V

W = VDD = 2.7 to 3.6V

Bus Width

3 = x8

4 = x16

Family Identifier

B = 2112 Bytes/ 1056 Word Page

Device Options

2 = Chip Enable Don't Care Enabled

3 = Chip Enable Don't Care Enabled and Automatic Page 0 Read at Power-up

Product Version

A = First Version

B= Second Version

C= Third Version

Package

N = TSOP48 12 x 20mm (all devices)

V = USOP48 12 x 17 x 0.65mm (512Mb and 1Gb devices)

ZA = VFBGA63 9.5 x 12 x 1mm, 0.8mm pitch (512Mb and 1Gb devices)

ZB = TFBGA63 9.5 x 12 x 1.2mm, 0.8mm pitch (2Gb Dual Die devices)

ZC = LFBGA63 9.5 x 12 x 1.4mm, 0.8mm pitch (8Gb Quadruple Die devices)

Temperature Range

1 = 0 to 70 °C

6 = –40 to 85 °C

Option

blank = Standard Packing

T = Tape & Reel Packing

E = Lead Free Package, Standard Packing

F = Lead Free Package, Tape & Reel Packing

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