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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32H753II 데이터시트(PDF) 333 Page - STMicroelectronics |
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STM32H753II 데이터시트(HTML) 333 Page - STMicroelectronics |
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333 / 361 page  Package information STM32H753xI 332/360 DS12117 Rev 8 Figure 129. UFBGA169 - Recommended footprint Note: Non-solder mask defined (NSMD) pads are recommended. Note: 4 to 6 mils solder paste screen printing process. F 0.450 0.500 0.550 0.0177 0.0197 0.0217 ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 222. UFBGA169 - Recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.27 mm Dsm 0.35 mm typ. (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter. Table 221. UFBGA169 - Mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. BGA_WLCSP_FT_V1 Dsm Dpad |
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