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STM32H753II 데이터시트(PDF) 349 Page - STMicroelectronics |
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STM32H753II 데이터시트(HTML) 349 Page - STMicroelectronics |
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349 / 361 page ![]() Package information STM32H753xI 348/360 DS12117 Rev 8 Device marking for TFBGA240+25 The following figure gives an example of topside marking versus pin 1 position identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below. Figure 142. TFBGA240+25 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 228. TFBGA240+25 - Recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness 0.100 mm MSv46115V1 Revision code Ball A1identifier STM32H753XIH6 Y WW Product identification(1) Date code R |
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