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STM32L062C8 데이터시트(PDF) 107 Page - STMicroelectronics |
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STM32L062C8 데이터시트(HTML) 107 Page - STMicroelectronics |
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107 / 124 page ![]() DS10183 Rev 11 107/124 STM32L062x8 Package information 117 7.3 Thin WLCSP36 package information Figure 37. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. 2. b dimensions is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. F G e1 e e e2 A1 Ball location A1 bbb Z b A A3 A2 DETAIL A BOTTOM VIEW SIDE VIEW E D A1 ORIENTATION REFERENCE TOP VIEW DETAIL A ROTATED 90 BUMP eee Z b (36x) ccc Z ddd Z X Y SEATING PLANE A1 aaa A097_ME_V2 |
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