Figure 9. Relative variation of critical rate of decrease of

main current versus (dV/dt)c (typical values)

0.1

1 .0

10.0

100.0

0.0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

(dI/dt)c [(dV/dt)c] / specified (dI/dt)c

C

B

(dV/dt)c(V/µs)

T1210/SW

T1235/T1250/CW/BW

Figure 10. Relative variation of critical rate of decrease of

main current versus (dV/dt)c (typical values)(TW)

0.1

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

1.0

10.0

100.0

TW, T1205

(dI/dt)c [(dV/dt)c] / specified (dI/dt)c

(dV/dt)c(V/µs)

Figure 11. Relative variation of critical rate of decrease of

main current versus junction temperature

0

2 5

5 0

7 5

100

125

0

1

2

3

4

5

6

Tj(°C)

(dl/dt)c [Tj] / (dl/dt)c [Tj specified]

Figure 12. D2PAK thermal resistance junction to ambient

versus copper surface under tab

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

Rth(j-a) (°C/W)

D²PAK

Epoxy printed board FR4, copper thickness = 35 µm

SCu(cm²)

BTA12, BTB12, T1205, T1210, T1235, T1250

Characteristics (curves)

DS2115 - Rev 12

page 6/16