MFS5600AMBA0ES datasheet(8/111 Pages) NXP

8 / 111 page

NXP Semiconductors

FS5600

Automotive buck regulator and controller with voltage monitors and watchdog timer

8 ESD Ratings

Symbol

Rating

Min

Unit

Human Body Model – all pins[1][2]

±2000

Charge Device Model – All pins[3][2]

±500

VESD

GUN discharged contact test – 2 kΩ/150 pF; 2 kΩ/300 pF; 300 Ω/150 pF –

Global pins[4]

±8000

Table 4. ESD ratings

[1]

ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), and the Charge Device Model (CDM),

Robotic (CZAP = 4.0 pF)

[2]

In accordance with AEC-Q-100 Rev H

[3]

ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), and the Charge Device Model (CDM),

Robotic (CZAP = 4.0 pF

[4]

In accordance with IEC61000-4-2 and ISO10605.2008

Caution

This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part.

Caution

This is an ESD sensitive device, improper handling can cause permanent damage to the part.

9 Thermal Characteristics

Symbol

Description (Rating)

Min

Max

Unit

Ambient Operating Temperature Range (Automotive)

–40

125

°C

Ambient Operating Temperature Range (Industrial)

–40

105

°C

Operating Junction Temperature Range

–40

150

°C

TPPRT

Peak package reflow temperature

—

260

°C

TST

Storage Temperature Range

–55

150

°C

Table 5. Temperature range

Rating

Board Type

Symbol

Value

Unit

Junction to Ambient Thermal Resistance[1]

JESD51-9, 2s2p

RθJA

36.3

°C/W

Junction-to-Top of Package Thermal Characterization

Parameter[1]

JESD51-9, 2s2p

ΨJT

4.5

°C/W

Junction to Ambient Thermal Resistance[1]

Customized, 2s4p

RθJA

31.7

°C/W

Junction-to-Top of Package Thermal Characterization

Parameter[1]

Customized, 2s4p

ΨJT

4.4

°C/W

Table 6. QFN32 thermal resistance and package dissipation ratings

FS5600

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 2 August 2022

8 / 111

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