DP83848-HT datasheet(5/81 Pages) TI

5 / 81 page

DP83848-HT

www.ti.com

SLLSEJ7 – FEBRUARY 2015

Bond Pin Coordinates in Microns (continued)

DESCRIPTION

PAD NUMBER

X MIN

Y MIN

X MAX

Y MAX

IOGND

399.647

1406.451

462.676

1468.988

IOVDD33

326.42

1406.451

389.448

1468.988

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage

–0.5

4.2

VIN

DC input voltage

–0.5

VCC + 0.5

VOUT

DC output voltage

–0.5

VCC + 0.5

Operating junction temperature

–55

150

°C

Tstg

Storage temperature

–65

150

°C

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±4000

ESD rating

V(ESD)

(RZAP = 1.5 kΩ,

Charged device model (CDM), per JEDEC specification JESD22-C101,

±1000

CZAP = 100 pF)

all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3.6

Operating free-air temperature(2)

–55

150

°C

Power dissipation

267

(1)

Absolute maximum ratings are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply

that the device should be operated at these limits.

(2)

Provided that Thermal Pad is soldered down.

7.4 Thermal Information

DP83848

THERMAL METRIC(1)

PHP

UNIT

48 PINS

RθJA

Junction-to-ambient thermal resistance

35.74

RθJC(top)

Junction-to-case (top) thermal resistance

21.8

RθJB

Junction-to-board thermal resistance

19.5

°C/W

ψJT

Junction-to-top characterization parameter

1.2

ψJB

Junction-to-board characterization parameter

19.4

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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