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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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VND9012AJ 데이터시트(PDF) 28 Page - STMicroelectronics |
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VND9012AJ 데이터시트(HTML) 28 Page - STMicroelectronics |
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28 / 40 page  6 Package and PCB thermal data 6.1 PowerSSO-16 thermal data Figure 21. PowerSSO-16 on two-layer PCB (2s0p to JEDEC JESD 51-5) Figure 22. PowerSSO-16 on four-layer PCB (2s2p to JEDEC JESD 51-7) Table 14. PCB properties Dimension Value Board finish thickness 1.6 mm +/- 10% Board dimension 77 mm x 86 mm Board Material FR4 Copper thickness (top and bottom layers) 0.070 mm Copper thickness (inner layers) 0.035 mm Thermal vias separation 1.2 mm Thermal via diameter 0.3 mm +/- 0.08 mm Copper thickness on vias 0.025 mm Footprint dimension (top layer) 2.2 mm x 3.9 mm Heatsink copper area dimension (bottom layer) Footprint, 2 cm2 or 8 cm2 VND9012AJ Package and PCB thermal data DS12727 - Rev 3 page 28/40 |
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