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TDA4VE...ALZQ1 데이터시트(PDF) 113 Page - Texas Instruments

부품명 TDA4VE...ALZQ1
상세설명  TDA4VE TDA4AL TDA4VL Jacinto™ Processors, Silicon Revision 1.0
PDF  251 Pages
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7.8 Thermal Resistance Characteristics
This section provides the thermal resistance characteristics used on this device.
For reliability and operability concerns, the maximum junction temperature of the device has to be at or below
the TJ value identified in Section 7.3, Recommended Operating Conditions.
7.8.1 Thermal Resistance Characteristics for ALZ Package
It is recommended to perform thermal simulations at the system level with the worst case device power consumption.
NO.
PARAMETER
DESCRIPTION
ALZ PACKAGE
°C/W
(1)(3)
AIR FLOW
(m/s)
(2)
T1
RΘJC
Junction-to-case
0.3
N/A
T2
RΘJB
Junction-to-board
2.0
N/A
T3
RΘJA
Junction-to-free air
10.4
0
T4
Junction-to-moving air
6.1
1
T5
5.3
2
T6
4.8
3
T7
ΨJT
Junction-to-package top
0.16
0
T8
0.17
1
T9
0.17
2
T10
0.17
3
T11
ΨJB
Junction-to-board
1.8
0
T12
1.5
1
T13
1.4
2
T14
1.4
3
(1)
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
•
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Packages
(2)
m/s = meters per second.
(3)
°C/W = degrees Celsius per watt.
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TDA4VE-Q1, TDA4AL-Q1, TDA4VL-Q1
SPRSP62 – DECEMBER 2022
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1



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