MPC855T datasheet(43/77 Pages) NXP

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MPC860 PowerQUICC Family Hardware Specifications, Rev. 10

Freescale Semiconductor

CPM Electrical Characteristics

11 CPM Electrical Characteristics

This section provides the AC and DC electrical specifications for the communications processor module

(CPM) of the MPC860.

11.1

PIP/PIO AC Electrical Specifications

Table 14 provides the PIP/PIO AC timings as shown in Figure 39 through Figure 43.

Figure 39. PIP Rx (Interlock Mode) Timing Diagram

Table 14. PIP/PIO Timing

Num

Characteristic

All Frequencies

Unit

Min

Max

Data-in setup time to STBI low

—

Data-in hold time to STBI high

2.5 – t31

1 t3 = Specification 23.

—CLK

STBI pulse width

1.5

—

CLK

STBO pulse width

1 CLK – 5 ns

—

Data-out setup time to STBO low

—

CLK

Data-out hold time from STBO high

—

CLK

STBI low to STBO low (Rx interlock)

—

CLK

STBI low to STBO high (Tx interlock)

—

CLK

Data-in setup time to clock high

—

Data-in hold time from clock high

7.5

—

Clock low to data-out valid (CPU writes data, control, or direction)

—

DATA-IN

STBI

STBO

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