Appendix 2 - 16

Figure 15. 24-Lead Flatpack, Dual Cavity

(50-mil lead spacing)

Notes:

1. Package material: opaque ceramic.

2. All package plating finishes are per MIL-PRF-38535.

3. It is recommended that package ceramic be mounted to a heat removal rail located in the

printed circuit board. A thermally conductive material should be used.

.810 MAX.

.600 MAX.

.400 MIN.

LEAD 1 INDICATOR

0.130 MAX.

0.070

±0.010

(AT CERAMIC BODY)

.050

0.016

±.002

.010 + .002 - .001