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PCF8576DH/2 데이터시트(PDF) 32 Page - NXP Semiconductors |
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PCF8576DH/2 데이터시트(HTML) 32 Page - NXP Semiconductors |
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32 / 41 page ![]() 2004 Dec 22 32 Philips Semiconductors Product specification Universal LCD driver for low multiplex rates PCF8576D handbook, full pagewidth S25 S26 S27 S28 S29 S30 S31 S32 S33 C2 2.26 mm A2 A1 C1 SA0 VSS BP2 BP0 VLCD BP1 BP3 S0 S2 S1 S3 PCF8576DU 2.01 mm MDB074 x y 0 0 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 52 53 54 55 56 57 58 59 12 3 4 56 7 8 43 44 45 46 47 48 49 S18 S19 S20 S21 S22 S23 S24 36 37 38 39 40 41 42 50 51 Fig.23 Bonding pad locations. Chip dimensions: approximately 2.26 × 2.01 mm. Bump dimensions (except pad 1): 52 × 80 × 17.5 (height) µm. Bump dimensions (pad 1): 52 × 76 × 17.5 (height) µm. Alignment marks: diameter = 72 µm. |
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