ADL6337ACRZA-R7 datasheet(6/41 Pages) AD

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Data Sheet

ADL6337

ABSOLUTE MAXIMUM RATINGS

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Rev. B | 6 of 41

Table 4. Absolute Maximum Ratings

Parameter

Rating

V50AMP1, V50AMP2, V50BIAS

−0.3 V to +5.6 V

SCLK, SDI, SDIO, CS, CS_A2, CS_A1, CS_A0,

TXENP

−0.3 V to +3.6 V

RF Input Power (IN_N, IN_P) at 50 Ω

10 dBm

Temperature

−40°C to +105°C

Operating Range (Measured at Exposed Pad)

Junction Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the conduction thermal resistance from junction to case

where the case temperature is measured at the bottom of the

package.

The thermal resistance value specified in Table 5 is simulated

based on JEDEC specifications (unless specified otherwise) and

must be used in compliance with JESD51-12.

Table 5. Thermal Resistance

Package Type

θJC

Unit

CR-32-3

7.4

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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