L9305 datasheet(98/107 Pages) STMICROELECTRONICS

98 / 107 page

Symbol

Dimensions

Note

Min.

Typ.

Max.

6.90

7.50

4.30

5.20

Notes:

Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.

All dimensions are in millimeters.

Dimensions D and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25

mm” per side D and “0.15 mm” per side E1. D and E1 are Maximum plastic body size dimensions including

mold mismatch.

The top package body size may be smaller than the bottom package size.

Datum A-B and D to be determined at datum plane H.

“N” is the max number of terminal positions for the specified body size.

The dimensions apply to the flat section of the lead between 0.10 to 0.25 mm from the lead tip.

Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.10 mm total in

exceed of the “b” dimension at maximum material condition. The dambar cannot be located on the lower

radius of the foot.

This Chamfer feature is optional. If it is not present, then a PIN 1 identifier must be located within the index

area indicated.

10. A1 is defined as the vertical distance from the seating plane to the lowest point on the package body.

11. Dimension D1 and E2 show the minimum allowed for the optional exposed pad. The size of exposed pad is

variable depending of leadframe design pad size. End user should verify “D1” and “E2” dimensions for each

device application.

10.5

PowerSSO-36 marking information

Figure 32. PowerSSO-36 marking information

PowerSSO-36 TOP VIEW

(not in scale)

Last two digits

ES: Engineering sample

<blank>: Commercial sample

Marking area

GAPG2904151300PS_ES

L9305

PowerSSO-36 marking information

DS12774 - Rev 8

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