9.2

TSSOP8 package information

This TSSOP is an 8-lead, 3 x 6.4 mm, 0.65 mm pitch, thin shrink small outline package.

Figure 15. TSSOP8 – Outline

6P_TSSOP8_ME_V3

1

c

L

E

D

k

e

4

L1

E1

A2

A

b

8

5

A1

Package TSSOP8 (package code 6P)

1.

Drawing is not to scale.

Table 18. TSSOP8 – Mechanical data

Symbol

millimeters

inches (1)

Min.

Typ.

Max.

Min.

Typ.

Max.

A

-

-

1.200

-

-

0.0472

A1

0.050

-

0.150

0.0020

-

0.0059

A2

0.800

1.000

1.050

0.0315

0.0394

0.0413

b

0.190

-

0.300

0.0075

-

0.0118

c

0.090

-

0.200

0.0035

-

0.0079

D(2)

2.900

3.000

3.100

0.1142

0.1181

0.1220

e

-

0.650

-

-

0.0256

-

E

6.200

6.400

6.600

0.2441

0.2520

0.2598

E1(3)

4.300

4.400

0.0177

0.1693

0.1732

0.1772

L

0.450

0.600

0.750

0.0181

0.0236

0.0295

L1

-

1.000

-

-

0.0394

-

k

0°

-

8°

0°

-

8°

aaa

-

-

0.100

-

-

0.0039

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed

0.15 mm per side

3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per

side.

Note:

The package top may be smaller than the package bottom. Dimensions D and E1 are determinated at the

outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interleads flash,

but including any mismatch between the top and bottom of plastic body. Measurement side for mold flash,

protusions or gate burrs is bottom side.

M24C01/02-W M24C01/02-R M24C02-F

TSSOP8 package information

DS9398 - Rev 7

page 28/41