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M24C01-W 데이터시트(PDF) 30 Page - STMicroelectronics

부품명 M24C01-W
상세설명  1-Kbit and 2-Kbit serial I²C bus EEPROMs
PDF  41 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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M24C01-W 데이터시트(HTML) 30 Page - STMicroelectronics

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9.3
SO8N package information
This SO8N is an 8-lead, 4.9 x 6 mm, plastic small outline, 150 mils body width, package.
Figure 17. SO8N – Outline
E1
8
ccc
b
D
c
1
E
h x 45˚
A2
k
0.25 mm
L
A1
GAUGE PLANE
e
A
L1
C
SEATING
PLANE
Package SO8N (package code O7)
1.
Drawing is not to scale.
Table 19. SO8N – Mechanical data
Symbol
millimeters
inches (1)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
-
-
1.750
-
-
0.0689
A1
0.100
-
0.250
0.0039
-
0.0098
A2
1.250
-
-
0.0492
-
-
b
0.280
-
0.480
0.0110
-
0.0189
c
0.100
-
0.230
0.0030
-
0.0091
D(2)
4.800
4.900
5.000
0.1890
0.1929
0.1969
E
5.800
6.000
6.200
0.2283
0.2362
0.2441
E1(3)
3.800
3.900
4.000
0.1496
0.1535
0.1575
e
-
1.270
-
-
0.0500
-
h
0.250
-
0.500
0.0098
-
0.0197
k
0°
-
8°
0°
-
8°
L
0.400
-
1.270
0.0157
-
0.0500
L1
-
1.040
-
-
0.0409
-
ccc
-
-
0.100
-
-
0.0039
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15 mm per side
3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per
side.
Note:
The package top may be smaller than the package bottom. Dimensions D and E1 are determinated at the
outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interleads flash,
but including any mismatch between the top and bottom of plastic body. Measurement side for mold flash,
protusions or gate burrs is bottom side.
M24C01/02-W M24C01/02-R M24C02-F
SO8N package information
DS9398 - Rev 7
page 30/41



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