MCP970X

DS20001942J-page 14

 2005-2022 Microchip Technology Inc. and its subsidiaries

Microchip Technology Drawing C04-061-LT Rev E Sheet 2 of 2

Number of Pins

Overall Height

Terminal Width

Overall Width

Terminal Length

Molded Package Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E1

A2

e

L

E

N

0.65 BSC

0.10

0.15

0.80

0.00

-

0.20

1.25 BSC

-

-

2.10 BSC

MILLIMETERS

MIN

NOM

5

0.46

0.40

1.10

0.10

MAX

c

-

0.08

0.26

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Lead Thickness

5-Lead Plastic Small Outline Transistor (LT) [SC70]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Overall Length

D

2.00 BSC

0.80

-

1.00

1.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

protrusions shall not exceed 0.15mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M