2.1

Features

The following are key features of the MSCSM70AM10CT3AG device:

• SiC Power MOSFET

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Low RDS(on)

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High-speed switching

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Ultra low loss

• SiC Schottky Diode

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Zero reverse recovery

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Zero forward recovery

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Temperature independent switching behavior

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Positive temperature coefficient on VF

• Very low stray inductance

• Kelvin source for easy drive

• Internal thermistor for temperature monitoring

• Aluminum nitride (AlN) substrate for improved thermal performance

2.2

Benefits

The following are benefits of the MSCSM70AM10CT3AG device:

• High-efficiency converter

• Outstanding performance at high-frequency operation

• Direct mounting to heatsink (isolated package)

• Low junction-to-case thermal resistance

• Solderable terminals for power and signal, for easy PCB mounting

• Low profile

• RoHS compliant

2.3

Applications

The MSCSM70AM10CT3AG device is designed for the following applications:

• Uninterruptible power supplies

• Switched mode power supplies

• EV motor and traction drive

• Welding converters

3

Microsemi Proprietary and Confidential MSCSM70AM10CT3AG Datasheet Revision 1.0

Product Overview