HC705C9AGRSSLASHD datasheet(149/157 Pages) NXP

149 / 157 page

MC68HC705C9A — Rev. 2.0

Ordering Information

General Release Specification — MC68HC705C9A

Section 14. Ordering Information

14.1 Contents

14.2

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .149

14.3

MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .149

14.2 Introduction

This section contains ordering information for the available package

types.

14.3 MC Order Numbers

Table 14-1 shows the MC order numbers for the available package

types.

Table 14-1. MC Order Numbers

Package Type

Temperature

Range

Order Number

40-Pin Plastic Dual In-Line Package (DIP)

–40

°C to 85°C

MC68HC705C9ACP

42-Pin Shrink Dual In-Line Package (SDIP)

–40

°C to 85°C

MC68HC705C9ACB

44-Lead Plastic Leaded Chip Carrier (PLCC)

–40

°C to 85°C

MC68HC705C9ACFN

44-Pin Quad Flat Pack (QFP)

–40

°C to 85°C

MC68HC705C9ACFB

NOTES:

1. P = Plastic dual in-line package (PDIP)

2. B = Shrink dual in-line package (SDIP)

3. FN = Plastic-leaded chip carrier (PLCC)

4. FB = Quad flat pack (QFP)

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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