HC705C9AGRSSLASHD datasheet(145/157 Pages) NXP

145 / 157 page

MC68HC705C9A — Rev. 2.0

Mechanical Specifications

General Release Specification — MC68HC705C9A

Section 13. Mechanical Specifications

13.1 Contents

13.2

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145

13.3

40-Pin Plastic Dual In-Line (DIP) Package (Case 711-03) . . .146

13.4

42-Pin Plastic Shrink Dual In-Line (SDIP) Package

(Case 858-01). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .146

13.5

44-Lead Plastic Leaded Chip Carrier (PLCC)

(Case 777-02). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .147

13.6

44-Lead Quad Flat Pack (QFP) (Case 824A-01) . . . . . . . . . .148

13.2 Introduction

This section describes the dimensions of the plastic dual in-line package

(DIP), plastic shrink dual in-line package (SDIP), plastic leaded chip

carrier (PLCC), and quad ﬂat pack (QFP) MCU packages. Package

dimensions available at time of this publication are provided in this

section. To make sure that you have the latest case outline

specifications, contact one of the following:

•

Local Motorola Sales Office

•

Motorola Mfax

–

Phone 602-244-6609

–

EMAIL rmfax0@email.sps.mot.com

•

Worldwide Web (wwweb) at http://design-net.com

Follow Mfax or wwweb on-line instructions to retrieve the current

mechanical specifications.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

HC705C9AGRS/D 데이터시트(PDF) 145 Page - NXP Semiconductors