ISL8200MM

FN7690 Rev 2.00

Page 5 of 24

Mar 15, 2013

23

NC

Not internally connected.

PD1

Phase Thermal Pad Used for both the PHASE pin (Pin # 16) and for heat removal connecting to heat dissipation layers using Vias. Connect this

pad to a copper island on the PCB board with the same shape as the PHASE thermal pad. Potential should be floating and

not electrically connected to anything except PHASE pin.

PD2

VIN Thermal Pad Used for both the PVIN pin (Pin # 17) and for heat removal connecting to heat dissipation layers using Vias. Connect this

pad to a copper island on the PCB board with the same shape as the VIN thermal pad. Potential should be floating and

not electrically connected to anything except VPVIN pin.

PD3

PGND Thermal Pad Used for both the PGND pin (Pin # 18) and for heat removal connecting to heat dissipation layers using Vias. Connect this

pad to a copper island on the PCB board with the same shape as the PGND thermal pad. Potential should be floating and

not electrically connected to anything except PGND pin.

PD4

VOUT Thermal Pad Used for both the VOUT pin (Pin # 19) and for heat removal connecting to heat dissipation layers using Vias. Connect this

pad to a copper island on the PCB board with the same shape as the VOUT thermal pad. Potential should be floating and

not electrically connected to anything except VOUT pin.

Pin Descriptions (Continued)

PIN

NUMBER

PIN

NAME

PIN DESCRIPTION

Typical Application Circuits

FIGURE 3. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT

(See Table 1,

VOUT - RSET on page 13)

ISL8200MMREP