ISL81601 datasheet(53/54 Pages) RENESAS

53 / 54 page

FN9299 Rev.3.1

Page 53 of 53

May 27, 2021

ISL81601

10. Package Outline Drawings

For the most recent package outline drawing, see M38.173C.

M38.173C

38 Lead Heat-Sink Thin Shrink Small Outline Plastic Package (HTSSOP)

Rev 0, 4/10

NOTES:

EXPOSED PAD VIEW

DETAIL "A"

SIDE VIEW

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

9.70±0.10

1.10 MAX

0.50

0.09-0.20

0.05/0.15

PIN 1 ID

0.90±0.05

SEATING

PLANE

SEE

DETAIL "A"

0.10

A-B

0.20

0.08

A-B

0.05

4.4±0.10

6.4

0.17-0.27

2X N/2 TIPS

0.25

0.6±0.10

LINE

PARTING

(1.00)

12 3

3.20±0.10

4.6±0.10

(0-8°)

(1.30)

(5.80)

(36X 0.50)

(38X 0.28)

(3.20)

(4.60)

SCALE: 30/1

(VIEW ROTATED 90°C.W.)

END VIEW

1. Die thickness allowable is 0.279±0.0127 (0.0110±0.0005 inches).

2. Dimensioning & tolerances per ASME. Y14.5m-1994.

3. Datum plane H located at mold parting line and coincident

with lead where lead exits plastic body at bottom of parting line.

4. At reference datum and does not include mold flash or protrusions,

and is measured at the bottom parting line. Mold flash or protrusions

shall not exceed 0.15mm on the package ends and 0.25mm between

5. The lead width dimension does not include dambar protrusion.

Allowable dambar protrusion shall be 0.07mm total in excess of

6. This part is compliant with JEDEC specification MO-153 variation BDT-1

the leads.

the lead width dimension at maximum material condition. Dambar

cannot be located on the lower radius or the foot. Minimum space

between protrusions and an adjacent lead should be 0.08mm.

(14°) TYP

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