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ADV7393EBZ 데이터시트(PDF) 95 Page - Analog Devices

부품명 ADV7393EBZ
상세설명  Low Power, Chip Scale 10-Bit SD/HD Video Encoder
PDF  96 Pages
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제조업체  AD [Analog Devices]
홈페이지  http://www.analog.com
Logo AD - Analog Devices

ADV7393EBZ 데이터시트(HTML) 95 Page - Analog Devices

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ADV7390/ADV7391/ADV7392/ADV7393
Rev. 0 | Page 95 of 96
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
EXPOSED PADDLE MUST BE SOLDERED
TO PCB GROUND FOR PROPER
HEAT DISSIPATION, NOISE IMMUNITY AND
MECHANICAL STRENGTH BENEFITS.
Figure 142. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
1
40
10
31
30
21
20
4.25
4.10 SQ
3.95
TOP
VIEW
6.00
BSC SQ
PIN 1
INDICATOR
5.75
BCS SQ
12° MAX
0.30
0.23
0.18
0.20 REF
SEATING
PLANE
1.00
0.85
0.80
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.80 MAX
0.65 TYP
4.50
REF
0.50
0.40
0.30
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOT TOM VIEW)
EXPOSED PADDLE MUST BE SOLDERED
TO PCB GROUND FOR PROPER
HEAT DISSIPATION, NOISE IMMUNITY AND
MECHANICAL STRENGTH BENEFITS.
Figure 143. 40-Lead Frame Chip Scale Package [LFCSP]
(CP-40)
Dimensions shown in millimeters



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