August 1986

7

Philips Semiconductors

Product specification

VHF power transistor

BLV21

The circuit and the components are situated on one side of the epoxy fibre-glass board, the other side being fully

metallized to serve as earth. Earth connections are made by means of hollow rivets, whilst under the emitter leads Cu

straps are used for a direct contact between upper and lower sheets.

Fig.8 Component layout and printed-circuit board for 175 MHz test circuit.

handbook, full pagewidth

MGP254

150

72

C1

C2

L1

L2

L3

L4

L5

L7

C4

C5

R1

+VCC

C6

L6

C7

C3

rivet